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Qualification of tool to tool matching of a color image inspection system for wafer backsides
(2010)
This diploma thesis deals with the qualification of the color image inspection of a wafer backside inspection system as a means of defect detection. Currently, the color image is used to provide a quick overview and visual impression of the wafer backside. The goal of the diploma thesis is to qualify the color image inspection to comply with all requirements of tool to tool matching. As a given standard, the existing hardware design of the wafer backside inspection system can not be altered and has to be used in its current state. Potential causes of uncertainty introduced by this hardware design will be accounted for. The main focus of the diploma thesis will be the investigation of the three main factors influencing the color image inspection. These factors are the detected intensity, the contrast and the image sharpness. Their adjustability, repeatability, reproducibility and effect on the tool to tool matching are going to be quantified, necessary improvements will be formulated and the implementation of these improvements is going to be tested. Additionally, new and existing software factors influencing defect detection will be investigated with regard to their effect on the tool to tool matching. Lastly, based on the findings of the diploma thesis, a series of suggestions will be formulated. They will help to plan additional qualification steps, if necessary, and provide the basis for composing a guideline to achieve tool to tool matching for all systems in the field.